Machines simplify our everyday life in many different ways. But for this to work smoothly, the human-machine interface must be kept as simple as possible.
US researchers have developed graphene printing technology that can produce flexible, low-cost, conductive and water-repellent electronic circuits.
As research teams worldwide explore ways to design a computer chip that can integrate quantum interactions, UNSW engineers believe they have found the solution.
The WICED CYW43907 evaluation kit, from Cypress Semiconductor, offers engineers a product that is said to reduce time to market when producing production-ready Internet of Things (IoT) designs.
The Modular Telematics Platform (MTP) from STMicroelectronics provides an open development environment for prototyping smart driving applications, including vehicle connectivity to back-end servers, road infrastructure and other vehicles.
STMicroelectronics is working together with Internet of Things (IoT) specialist Objenious, a founding member of the LoRa Alliance, to accelerate the connection of IoT nodes to LoRa networks.
The DE10-Nano development kit, from Terasic Technologies, is a robust hardware design platform built around an Intel system-on-chip (SoC) FPGA, which combines a processor, peripherals and an FPGA fabric into a single, user-customisable device.
European researchers have used cheap electronic components to create 'FlyPi' — a low-cost imaging and microscope system for research, training and teaching.
Aleph Objects and IC3D Industries have announced the availability of what is claimed to be the world's first certified open-source hardware 3D printing filament.
The high-connectivity STM32L4 IoT Discovery kit from STMicroelectronics offers flexibility for developers building IoT nodes by supporting multiple low-power wireless standards and Wi-Fi, while integrating a complete collection of motion, gesture and environmental sensors.
The Silicon Labs zigbee connected home reference designs help developers of home automation devices accelerate time to market and reduce system cost and complexity.
Two ready-to-use prototype boards from STMicroelectronics will enable developers to better evaluate LoRaWAN and other low-power wide area network (LPWAN) technologies, including 6LoWPAN.
Monash University has used a $3.5 million 3D printer to produce an aluminium door hinge for a Chinese jet airliner.
The Maxim MAXREFDES143# embedded security reference design provides protection against counterfeit sensor data, guaranteeing its authenticity and integrity along the entire data chain, from transducer to the cloud.
The Gadget Renesas SAKURA-II and SAKURA-FULL are general-purpose programmable boards that offer a highly flexible platform suitable for a range of levels of software development experience.