System-on-chip

Article (3)
  • New tricks for old dogs
    We’re all familiar with the old ‘break-fix’ model of service - it’s been the way of life for many years. It works well; it generates revenue and keeps you in business alongside hardware sales. The problem is that it’s a short-term solution for a long-term user.
  • Here COMes the future!
    Five years on, the PCI Industrial Computer Manufacturers Group (PICMG) has now released a new revision of the COM.0 Computer-on-Module standard that responds to new functionalities that Intel, AMD and other manufacturers are investing in their upcoming processor families.
  • Polymer microneedles for blood extraction
    Imec has made hollow, out-of-plane microneedles with a height of 1540 µm and an aspect ratio exceeding 100. The needles are made from a polymer (SU-8) and the process is repeatable.
Product (9)
  • Maxim TINI integrated SoCs and codec range
    Maxim has released its TINI family of integrated SoCs and codecs for consumer applications.
  • Renesas SuperSpeed universal serial bus SATA3 bridge system-on-chip
    Renesas has released its SuperSpeed universal serial bus (USB 3.0) SATA3 bridge system-on-chip that enables data transfer between a USB 3.0 host system and a Serial ATA (SATA) device in external USB storage equipment.
  • Ampro ETX-PVR ETX computer-on-module
    Adlink has announced the Ampro ETX-PVR, its latest Extreme Rugged ETX computer-on-module.
  • Kontron ETXexpress-SC computer-on-module
    Parallel to the launch of the second generation Intel Core processor family, Kontron has introduced the COM Express basic form factor ETXexpress-SC computer-on-module.
  • Kontron ETXexpress-AI computer-on-module
    Coinciding with the launch of the COM Express 2.0 specification by the PCI Industrial Manufacturers’ Group (PICMG), Kontron has released an additional version of the computer-on-module ETXexpress-AI, based on the COM Express Type 6 pinout definition.
  • RF Micro Devices ML2730 transceiver
    RF Micro Devices has introduced the ML2730, a single-chip fully integrated frequency shift keyed transceiver with integrated power amplifier and low-noise amplifier.
  • Low power SoC
    Nordic Semiconductor has launched what it claims is the world’s smallest and most highly integrated single chip 2.4 GHz ultra-low power wireless system-on-chip — the nRF24LE1.
  • Network appliance
    Advantech has introduced the FWA-3240 1U network appliance, claimed to be the first featuring the Intel EP80579 integrated processor system-on-a-chip (SOC).
  • Long range modules
    AeroComm's ZB2430 module, based on Texas Instruments' 802.15.4 SoC & Z-Stack technology, is claimed to be one of the most powerful ZigBee-compliant solutions available.
News (3)
  • 3D microchips and super cooling coming
    A technology for stacking several layers of microprocesssors, which is being developed at EPFL in collaboration with ETHZ and IBM Research, could boost the performance of computer chips by a factor of 10.
  • Data transfer at 60 GHz
    Rapid transfer of a high-definition movie from a PC to a mobile phone — plus a host of other media and data possibilities — is approaching reality.
  • Another company joins 3D research
    IMEC, Europe's nanoelectronics research institute, and Qualcomm, will collaborate to understand and devleop solutions for using 3D technologies in future wireless products.
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