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Look out silicon here comes graphene
Graphene, a form of bonded carbon, may become the next buzz word in electronics over the next 10 to 20 years if the current rate of miniaturisation continues
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NiMH charger IC
Maxim has introduced the DS2710, a standalone NiMH charger IC with alkaline-cell detection. Said to be the smallest charger IC to incorporate fast-charge control and alkaline-cell detection, it saves space and cost.
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Universal board
Boston Technology has introduced a 6U CompactPCI universal board incorporating the latest Dual-Core Xeon processor.
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Embedded computer
The UC-7112 Plus has two RS232/422/485 serial ports and dual 10/100 Mbps ethernet LAN ports, providing a serial communication for industrial applications. It has 32 MB of RAM, 16 MB of flash memory and an SD socket, giving a variety of storage options for running applications.
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Testing 3D stacked ICs
Imec Belgium and Cadence Design Systems have announced an automated test solution for design teams.
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NICTA spin-out wins more funding
Open Kernel Labs has gained a further US$7.6 million in venture funding. The company is a spin-out organisation of NICTA, Australia's Information and Communications Technology research centre of excellence.
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Taitronics set to open in October
Taitronics, one of the world's biggest electronics exhibtions, will open its doors in Taiwan from October 7 to 11 when visitors from all over the world are expected to converge on more than 1000 exhibitors and 2400 stands in Taipei.
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New board members join NICTA
Loftus Harris and Dr Chris Beare have joined the board of NICTA.
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$25 million funding from NSW government welcomed
NICTA, Australia’s Information and Communications Technology (ICT) Research Centre of Excellence, welcomes the $25 million funding over five years from 2007–2012 from the NSW government.
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Silicon revolution on the way
Silicon nanocrystals and printed forms of silicon will transform electronics over the next decade with new memory, logic, photovoltaic and optoelectronic products enabled by this new technology reaching $2.5 billion in revenue by 2015, according to a report from NanoMarkets LC, a market research firm.
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Magnetic properties of thin films
Materials researchers at the National Institute of Standards and Technology (NIST), together with colleagues from IBM and the Massachusetts Institute of Technology, have pushed the measurement of thin films to the edge to produce data on how the edges of metallic thin films contribute to their magnetic properties.
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Icy road test proof: wedge shortens braking distance
The electronic wedge brake (EWB) from Siemens claims to reduce braking distance on snowy and icy roads by up to 15%.
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Alliance agreement
MooreHawke and Emerson Process Management have signed an Alliance Agreement to co-market MooreHawke fieldbus interface solutions through Emerson's worldwide sales network.
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Electromagnetic modelling package speeds design of active electron optic X-ray tubes
The 3D version of Vector Fields' electromagnetic modelling algorithm for charged particle beams is playing a key role in the development cycle of Philips Medical Systems' first commercial X-ray imaging systems with 'active optics'.
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Chip debugging automated
Engineering researchers at the University of Michigan have developed a technology to automate ‘post-silicon debugging’.
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Winners of Printed Electronics Awards announced
The IDTechEx Printed Electronics Awards have been presented in recognition of outstanding achievement. The awards were presented by Dr Peter Harrop, CEO of IDTechEx.
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Mobile WiMAX agreement signed
Beceem Communications, provider of terminal chipsets for Mobile WiMAX, has entered into an agreement with D-Link, Taiwanese consumer and enterprise networking equipment provider.
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Personalisation and content key drivers to demand
Personalisation and content are key drivers behind increased demand for notebook PCs and mobile internet devices (MIDs), according to Intel Corporation executives.
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