Researchers from the Commerce Departments National Institute of Standards and Technology reported they have developed methods for characterising key structural features of porous films being eyed as insulators for the ultrathin metal wires that will connect millions of devices on future microprocessors and increase processor speed.
Intel are be releasing a PC microprocessor with a new capability developed with the assistance of Dean Tullsen, called hyper-threading. The processor executes instructions from multiple threads/programs at once, as if they all came from a single thread. The CPU duplicates the architectural state on each processor, while sharing one set of processor execution resources. It makes one processor appear as two to the operating system.
Scientist from the Fraunhofer Institute for Computer Graphics Research IGD are working on a voice analysis system and a camera with image processing. They are focussing on designing voice activated electrical appliances and electronic equipment. An example may be a video recorder that is activated by someone saying "Record the news on channel 7 this evening" or a lamp which is turned off by the voice command of "lamp out".
A wafer scale foundry-based method of hermetically sealing surface sensitive devices such as MEMS and RF has been released by Ziptronix. It operates at room temperature using industry standard tools and materials and incorporating both MEMS and IC technologies.
A team of Cornell University researchers is planning to develop a method to connect wires to organic transistors. They are hoping this could lead to computers that are smaller, cheaper and more flexible - literally.
Intel Corporation has made several technology breakthroughs that the company has integrated into its 90-nanometre process. It has used this process to build silicon structures and memory chips. It will put this process into volume manufacturing next year using 300 mm wafers.
IBM scientists have developed a transistor technology that could enable production of a new class of smaller, faster and lower power computer chips than currently possible with silicon.
In the active-matrix liquid-crystal displays (AMLCDs)now typically found in laptop computers and an increasing number of monitors, each pixel is driven by an amorphous-silicon transistor that is fabricated directly onto the glass
Royal Philips Electronics has launched a semiconductor passive integration technology that the company said will lower costs for handset manufacturers.
The DeviceMate development kit offers integration of hardware and software, allowing users to remotely monitor and supervise any programmable device equipped with a serial interface. The kit contains everything needed to jumpstart development, including the RCM2200 core module as the DeviceMate unit, a sample target unit, complete DeviceMate software with no royalties or licence fees, and a demonstration system.
Hyper-threading is something of a mystery, and Intel are still unsure how to release it successfully to the industry.
Philips has just introduced a technology that enhances luminance and colour saturation in transflective liquid-crystal displays without significantly increasing power consumption.
IBM has discovered a way to alter silicon, the fundamental material at the heart of microchips, and the breakthrough is expected to increase chip speeds by up to 35%.