Components

ADLINK cPCI-6630 6U CompactPCI processor blade

27 April, 2017 by | Supplied by: ADLINK Technology Inc

The ADLINK cPCI-6630 6U CompactPCI processor blade has a 6th generation Intel Core i7 processor in a 6U form factor.


Vincotech VINco E3 power IGBTs

26 April, 2017 by | Supplied by: Wireless Components

The Vincotech VINco E3 power IGBTs are designed for motion control, solar and UPS applications.


Spherical drone display developed

26 April, 2017 by

NTT DOCOMO has developed what it claims is the world's first spherical drone display — an unmanned aerial vehicle that displays LED images on an omnidirectional spherical screen while in flight.


Graphene 'copy machine' to produce cheaper wafers

24 April, 2017 by

MIT engineers have developed a technique that could vastly reduce the overall cost of wafer technology for the semiconductor industry, enabling devices made from more exotic, higher performing materials than conventional silicon.


Carbon nanotubes strengthen flexible electronics

24 April, 2017 by

US researchers have synthesised thin carbon nanotube (CNT) textiles that exhibit both high electrical conductivity and a level of toughness that is about 50 times higher than the copper films currently used in electronics.


Understanding how modern induction cookers work

21 April, 2017 by Akshat Jain and Ranajay Mallik, AMG Central Lab, STMicroelectronics, India | Supplied by: STMicroelectronics Pty Ltd

The induction cooktop is quite popular, both in domestic and commercial usage, and is considered one of the advanced technological innovations in the field of cooking.


Single-molecule diode created

19 April, 2017 by | Supplied by: Curtin University

Australian and Spanish researchers have made a significant breakthrough in the quest to create smaller everyday electronic devices.


A microprocessor based on a 2D semiconductor

18 April, 2017 by

Researchers have developed a microprocessor based on atomically thin materials, in a breakthrough which could contribute to the evolution of traditional processors as well as new applications in the field of flexible electronics.


2D nanomaterials create printed electronics

12 April, 2017 by

Researchers have fabricated printed transistors consisting entirely of two-dimensional nanomaterials for the first time, in a breakthrough which combines exciting electronic properties with the potential for low-cost production.


Transistors made of reduced graphene oxide

12 April, 2017 by

Researchers have developed a technique for converting positively charged (p-type) reduced graphene oxide (rGO) into negatively charged (n-type) rGO, creating a layered material that can be used to develop rGO-based transistors for use in electronic devices.


Inkjet-printable electronics on the way

11 April, 2017 by

Researchers from Germany and Canada are paving the way for mass-producing printable electronics by demonstrating a fully inkjet-printable flexible resistive memory.


Rockwell Automation Allen Bradley Kinetix VPC servo motor

11 April, 2017 by | Supplied by: Rockwell Automation Australia

The Rockwell Automation Allen Bradley Kinetix VPC servo motor provides high continuous torque at high speeds over long periods of time.


Concurrent Technologies AdvancedMC AM G6x/msd module

11 April, 2017 by | Supplied by: Unitronix Pty Ltd

The Concurrent Technologies AdvancedMC AM G6x/msd module is based on the latest generation of Intel processors.


Ultrafast memories for flexible electronics

04 April, 2017 by

Engineering experts have developed what they claim are the quickest, smallest, highest-capacity memories for flexible and transparent applications, using a hybrid of graphene oxide and titanium oxide.


6U OpenVPX CHAMP-XD2M Intel Xeon D multicore HPEC module

03 April, 2017 by | Supplied by: Unitronix Pty Ltd

The 6U OpenVPX CHAMP-XD2M rugged Intel Xeon D multicore HPEC module is designed for use in high memory capacity, compute-intensive industrial, aerospace and defence applications.


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