NTT DOCOMO has developed what it claims is the world's first spherical drone display — an unmanned aerial vehicle that displays LED images on an omnidirectional spherical screen while in flight.
MIT engineers have developed a technique that could vastly reduce the overall cost of wafer technology for the semiconductor industry, enabling devices made from more exotic, higher performing materials than conventional silicon.
US researchers have synthesised thin carbon nanotube (CNT) textiles that exhibit both high electrical conductivity and a level of toughness that is about 50 times higher than the copper films currently used in electronics.
The induction cooktop is quite popular, both in domestic and commercial usage, and is considered one of the advanced technological innovations in the field of cooking.
Researchers have developed a microprocessor based on atomically thin materials, in a breakthrough which could contribute to the evolution of traditional processors as well as new applications in the field of flexible electronics.
Researchers have fabricated printed transistors consisting entirely of two-dimensional nanomaterials for the first time, in a breakthrough which combines exciting electronic properties with the potential for low-cost production.
Researchers have developed a technique for converting positively charged (p-type) reduced graphene oxide (rGO) into negatively charged (n-type) rGO, creating a layered material that can be used to develop rGO-based transistors for use in electronic devices.
Researchers from Germany and Canada are paving the way for mass-producing printable electronics by demonstrating a fully inkjet-printable flexible resistive memory.
The Rockwell Automation Allen Bradley Kinetix VPC servo motor provides high continuous torque at high speeds over long periods of time.
The Concurrent Technologies AdvancedMC AM G6x/msd module is based on the latest generation of Intel processors.
Engineering experts have developed what they claim are the quickest, smallest, highest-capacity memories for flexible and transparent applications, using a hybrid of graphene oxide and titanium oxide.
The 6U OpenVPX CHAMP-XD2M rugged Intel Xeon D multicore HPEC module is designed for use in high memory capacity, compute-intensive industrial, aerospace and defence applications.
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