RF-35A2 is designed with an ultra-low fiberglass content to achieve‘best in class’ insertion-loss properties and a homogeneous dielectric constant throughout the laminate.
The uniform dispersion yields extremely low x and y coefficients of thermal expansion. The low modulus and low x-y CTE values make substrate suitable for surface mounting chip carriers. It is manufactured in a multi-step process that provides good dielectric properties along with copper peel adhesion.
The low 0.0011 dissipation factor at 1.9 GHz allows maximum power transfer, resulting in low heat generation.
It has low loss; Dk tolerance of +/-0.05; homogeneous Dk; good peel strength; low moisture absorption; ease of drilling.
Applications include: power amplifiers; filters/couplers; high-speed digital devices; passive components; wireless antennas.