Samtec has introduced its RF interconnect catalogue that includes standard RF applications and solutions for high-density and custom challenges. The company offers free samples and quotes in 24 h, no minimum order quantities and a 2- to 3-day lead time on standard products.
One new product featured is an SMP board-to-board and cable assembly system with flexibility to meet virtually any design challenge.
In addition, a high-density BNC, with four times the panel density of traditional BNCs, offers true 75 Ω performance with additional strain and space constraints. Complete interconnect solutions encompass 50 and 75 Ω board mount connectors, cable components and assemblies, as well as IsoRate isolated signal systems and Bull’s Eye test point systems.
For more information, see www.samtec.com/rf.