Posted: Mar 8, 2010

SOC provider joins alliance

Essensium NV, a fabless provider of low-power systems-on-chip, has joined the Wavenis Open Standard Alliance as a participating member, enabling it to influence the voting committees as the first semiconductor member while continuing its partnership with Coronis SAS to complete Coronis's first Wavenis-compliant SOC. Read more »

Posted: Mar 4, 2010

Partnership announced

Bestech Australia has formed a partnership with Portuguese company Fiber Sensing, a supplier of fibre-optic sensors. The deal allows Bestech to supply sensors with fibre bragg grating that is claimed to offer: high multiplexing capability; long-distance transmission; EMI/RFI immunity; electric isolation; signal integrity; long-term stability. Read more »

Posted: Mar 4, 2010

Medical beam steering magnet on line

The Opera electromagnetic simulator has played an important role in the design of the particle beam steering magnet currently being commissioned at Italy's hadron therapy centre in Milan - the Centro Nazionale di Adroterapia Oncologica (CNAO). Read more »

Posted: Mar 1, 2010

Solution centre opens in China

Semikron has expanded its global network of solution centres to Zhuhai, China, that specialises in designing and manufacturing Semistack power assemblies, for wind generators and solar power inverters. Read more »

Posted: Mar 1, 2010

Industrial robots collaboration

National Instruments and Denso Robotics are collaborating to integrate NI measurement and vision technology with Denso robotic arms. This is expected to increase productivity and performance in automated test, research and flexible manufacturing applications. Read more »

Posted: Feb 26, 2010

All-optical switching moves closer

An ultra-small and fast, electrically pumped all-optical memory on a silicon chip with record low power consumption has been produced by imec and its associated laboratory INTEC at the Ghent University. Read more »

Posted: Feb 25, 2010

Analyser workshop

Agilent is holding a series of spectrum analyser workshops in major cities across Australia. Read more »

Posted: Feb 24, 2010

3D microchips and super cooling coming

A technology for stacking several layers of microprocesssors, which is being developed at EPFL in collaboration with ETHZ and IBM Research, could boost the performance of computer chips by a factor of 10. Read more »

Posted: Feb 23, 2010

LED chip plant opens in Malaysia

Two years after breaking ground in July 2007, Osram Opto Semiconductors has built and process-tested what is claimed to be the world's most modern LED chip production plant, in Penang, Malaysia. Read more »

Posted: Feb 18, 2010

Ethernet distribution

Digi-Key and Vitesse Semiconductor have signed a global distribution agreement. Read more »

Posted: Feb 17, 2010

MD appointed

Eaton Corporation has appointed Craig Gob as managing director for the company’s Electrical Business in Australia and New Zealand based in Sydney. Read more »

Posted: Feb 17, 2010

Global distribution agreement

Digi-Key Corporation and Amphenol Sine Systems have signed an agreement for the worldwide distribution of Sine Systems interconnect products. Read more »

Posted: Feb 16, 2010

Penang office

Premier Farnell is expanding in the Asia Pacific with a new sales office in Penang, Malaysia. Read more »

Posted: Feb 15, 2010

Laser cooling

Nextreme Thermal Solutions says it has cooled a laser diode in a TO-8 package using an embedded thin-film thermoelectric OptoCooler HV14 module. Read more »

Posted: Feb 12, 2010

Global deal

Mouser Electronics has extended its distribution agreement with EPCOS into Europe and Asia. Read more »

Posted: Feb 10, 2010

Calibration on the road

Celemetrix Australia has taken its calibration service on the road, providing 24-hour turnaround time competitive pricing traceable to national standards with a pick-up and delivery service available. Read more »

Posted: Feb 9, 2010

Memory research

Numonyx and Intel have demonstrated a 64 Mb test chip that has the ability to stack or place multiple layers of PCM arrays within a single die, allowing memory devices to be built with greater capacity, lower power consumption and smaller. Read more »

Posted: Feb 5, 2010

Distribution expands

Origin Electronics Asia has extended its distribution agreement with Lattice Semiconductor from Greater China, ASEAN and India into Korea. Read more »

Posted: Feb 3, 2010

Industrial robots collaboration

National Instruments and Denso Robotics are collaborating to integrate NI measurement and vision technology with Denso robotic arms. This is expected to increase productivity and performance in automated test, research and flexible manufacturing applications. Read more »

Posted: Feb 3, 2010

SOC provider joins alliance

Essensium NV, a fabless provider of low power systems-on-chip, has joined the Wavenis Open Standard Alliance as a participating member, enabling it to influence the voting committees as the first semiconductor member, while continuing its partnership with Coronis SAS to complete Coronis's first Wavenis-compliant SOC. Read more »